CoolPAKTM Power Module

New power packaging technology from KSR solves design challenges found in electro-hydraulic power steering (EHPS), electric power steering (EPS) and automotive Motor Control applications. Our CoolPAKTM modules create a viable path to the transition from hydraulic steering systems to EHPS and EPS systems.

The KSR CoolPAKTM power inverter packaging technology delivers the lowest package inductance and resistance by minimizing the number of layers to improve thermal performance while reducing the number of interconnections.

Lower thermal resistance allows the use of smaller silicon devices, and lower inverter electrical resistance allows for higher current capabilities. For medium to high power applications, DOL packaging offers better electrical conductivity and increased thermal performance than alternative packaging methods using insulated metal substrate (IMS), direct-bonded copper (DBC) to a ceramic substrate, thick film substrates or PCB based modules, which primarily utilize discrete power devices.

Features include:
• Simplicity: lower number of components (no DBC or IMS substrates)
• Minimum number of layers along the thermal path for low Rthj die-to-heatsink
• Low package electrical resistance and inductance for low power losses
• Lower Junction Temperature and/or Die Size


KSR is an industry leader in the design, engineering and manufacture of an array of products for the transportation industry (autos, light trucks, ATVs), including automotive sensors, electronic throttle controls, adjustable and fixed pedals, electric steering control units and power modules.

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